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銅掀

English translation: separation (of the copper interconnect from the wafer)


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14:55 Mar 1, 2011
Chinese to English translations [PRO]
Tech/Engineering - Electronics / Elect Eng
Chinese term or phrase: 銅掀
檢測元件封合後的外觀和極性是否正常檢測的項目有銅掀、破裂、側翻、全翻、腳歪及極性 ...
www.ytec.com.tw/product_ate3.php
Li Gang
Local time: 06:15
English translation:separation (of the copper interconnect from the wafer)
Explanation:
Caveat: I don’t work in this field at all, so this is a suggestion that is based purely on the linguistics and is not what I would call an answer.

As mentioned in my discussion entry, I looked up the definition of the word 掀 in dict.revised.moe.edu.tw and, based solely on the definition of the word, my guess for 銅掀 would be a kind of defect where the copper interconnect becomes separated from the wafer.

Someone familiar with IC fabrication and testing should be able to tell if this is on the right track, and, if it is, what this kind of defect is called and provide the real answer.
Selected response from:

Ambrose Li
Canada
Local time: 18:15
Grading comment
4 KudoZ points were awarded for this answer



Summary of answers provided
2separation (of the copper interconnect from the wafer)
Ambrose Li
3 -1Copper moldingSameh Samy


Discussion entries: 2





  

Answers


7 hrs   confidence: Answerer confidence 3/5Answerer confidence 3/5 peer agreement (net): -1
Copper molding


Explanation:
I think this meaning.

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Note added at 7 hrs (2011-03-01 22:36:00 GMT)
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item.taobao.com/item.htm?id=4594618738
sports.china.com/zh_cn/sportsnews/.../12519817.html

Example sentence(s):
  • 中国泳军收获两铜掀高潮
  • 手工必备铜掀钮一口价 ...
Sameh Samy
Egypt
Local time: 00:15
Native speaker of: Native in ArabicArabic

Peer comments on this answer (and responses from the answerer)
disagree  Adsion Liu: 所給例句與問題語境根本無關 Copper molding 是一種工藝過程,而非缺陷
4 hrs
  -> 掀 word for word meaning is "lifting",and I think "lifting" is a step in molding operation, also I think the defect isn't in "molding", but in "copper" itself.
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11 hrs   confidence: Answerer confidence 2/5Answerer confidence 2/5
separation (of the copper interconnect from the wafer)


Explanation:
Caveat: I don’t work in this field at all, so this is a suggestion that is based purely on the linguistics and is not what I would call an answer.

As mentioned in my discussion entry, I looked up the definition of the word 掀 in dict.revised.moe.edu.tw and, based solely on the definition of the word, my guess for 銅掀 would be a kind of defect where the copper interconnect becomes separated from the wafer.

Someone familiar with IC fabrication and testing should be able to tell if this is on the right track, and, if it is, what this kind of defect is called and provide the real answer.

Ambrose Li
Canada
Local time: 18:15
PRO pts in category: 4

Peer comments on this answer (and responses from the answerer)
agree  Adsion Liu: This makes sense in my eyes...
1 hr

disagree  Sameh Samy: I know you mean "stripping", and I thought that before, but I don't think so, please see my examples.
9 hrs
  -> No, stripping is the intentional removal of electroplated copper, while separation would be an unintended separation of electroplated copper from the wafer. Stripping is not a defect.
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