Login or register (free and only takes a few minutes) to participate in this question.You will also have access to many other tools and opportunities designed for those who have language-related jobs (or are passionate about them). Participation is free and the site has a strict confidentiality policy.
Dutch to English translations [PRO] Tech/Engineering - Electronics / Elect Eng / circuit boards or printed circuits | | Dutch term or phrase: vulgraad | De multilayer bouwwijze heeft bovendien een zeer hoge vulgraad.
Does it mean physical capacity as in space or room? |
| | | (component) density | Explanation: 'Vulgraad' doesn't strike me as standard terminology in this context, but based on experience (in electronics) I would understand it to mean 'component density'. That's plausible because multilayer construction allows the interconneting tracks to be routed 'on top of each other', so they take up proportionally less of the board area -- which allows the components to be placed closer together (higher density).
Sample ref:
Cost-effective layout of microprocessor boards
Multi-layer construction is accepted practice for high performance circuits which use high value components such as 32-bit microprocessors and other VLSI peripherals. It may also be necessary to permit sufficiently high interconnect and component density, or to allow close control of track characteristic impedance. In these cases the much higher cost of multi-layer compared to conventional construction is either a small fraction of the overall product cost or is regarded as a necessary expense to meet the performance requirements.
www.elmac.co.uk/c_e_layt.htm
x |
| Selected response from: Ken Cox Local time: 12:42
| Grading comment Many thanks for this very full answer. 4 KudoZ points were awarded for this answer |
| |
| Discussion entries: 0 |
|---|
Automatic update in 00:
|
54 mins confidence:  peer agreement (net): +4 (component) density
Explanation: 'Vulgraad' doesn't strike me as standard terminology in this context, but based on experience (in electronics) I would understand it to mean 'component density'. That's plausible because multilayer construction allows the interconneting tracks to be routed 'on top of each other', so they take up proportionally less of the board area -- which allows the components to be placed closer together (higher density).
Sample ref:
Cost-effective layout of microprocessor boards
Multi-layer construction is accepted practice for high performance circuits which use high value components such as 32-bit microprocessors and other VLSI peripherals. It may also be necessary to permit sufficiently high interconnect and component density, or to allow close control of track characteristic impedance. In these cases the much higher cost of multi-layer compared to conventional construction is either a small fraction of the overall product cost or is regarded as a necessary expense to meet the performance requirements.
www.elmac.co.uk/c_e_layt.htm
x
| Ken Cox Local time: 12:42 Specializes in field Native speaker of: English PRO pts in category: 76
|
| | Grading comment | Many thanks for this very full answer. |
|
|
| |