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|English to French translations [PRO]|
Tech/Engineering - Electronics / Elect Eng
|English term or phrase: tapeout|
|The first Lot of New PQP Product Wafers from any new tapeout shall be a Hot Lot at no added cost or expense to Customer.|
fabrication de semi-conducteurs
|création du photomasque (lignes de découpe) par film|
In electronics design, tape-out or tapeout is the final result of the design cycle for integrated circuits or printed circuit boards, the point at which the artwork for the photomask of a circuit is sent for manufacture.
Some sources have indicated that the roots of the term can be traced back to the time when paper tape and later magnetic tape reels were loaded with the final electronic files used to create the photomask at the factory. Other sources reference the early days of printed circuit design, when the enlarged (for higher precision) "artwork" for the photomask was manually "taped out" using black line tape and adhesive-backed die cut elements on sheets of PET film. Subsequently the artwork was photographically reduced. A similar process was used for early integrated circuits.
The term tapeout currently is used to describe the creation of the photomask itself from the final approved electronic CAD file. This stage is sometimes referred to as PG, for Pattern Generation.
Un masque permettant de déterminer les lignes de découpe (31b) est formée par un film de réserve (31a), puis la tranche semi-conductrice (6) est divisée en pièces individuelles d'éléments semi-conducteurs (6c)
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|Changes made by editors|
|Aug 30, 2013 - Changes made by Marcombes:|
|Created KOG entry||KudoZ term => KOG term|| |
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