Login or register (free and only takes a few minutes) to participate in this question.
You will also have access to many other tools and opportunities designed for those who have language-related jobs (or are passionate about them). Participation is free and the site has a strict confidentiality policy.
3. The electronic enclosure cooling system of claim 2, wherein said liquid-to-air heat exchanger further comprises a condenser coil having a plurality of cooling fins, said condenser coil being shaped to fit about a central cooling fan.
4. The electronic enclosure cooling system of claim 3, wherein said liquid-to-air heat exchanger is mounted externally on top of said housing.
5. The electronic enclosure cooling system of claim 2, wherein said liquid-to-air heat exchanger is a ***flat pack radiator***.
6. The electronic enclosure cooling system of claim 1, further comprising a ***flat pack radiator*** disposed within said housing and connected to said closed fluid loop of said heat transfer fluid, wherein said flat pack radiator is adapted to remove heat from air within the housing.
7. The electronic enclosure cooling system of claim 1, further comprising a battery backup power system.
8. The electronic enclosure cooling system of claim 7, further comprising at least one battery cooling modular low profile unit for receiving heat from said battery backup power system, said at least one battery cooling modular low profile unit having a plurality of micro tubes connected to said closed fluid loop of said heat transfer fluid.
9. The electronic enclosure cooling system of claim 1, wherein said heat transfer fluid is a water/ethylene glycol mixture.
10. A modular low profile unit for use in a cooling system for removing heat from at least one heat generating component, said modular low profile unit comprising:
a heat sink in contact with said at least one heat generating component;
at least one low profile extrusion of unitary construction having an exterior surface in contact with said heat sink and adapted for receiving heat from said heat sink being formed with a unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes being provided with a microtube inlet and a microtube outlet;
a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion;
a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;
at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold;
at least one fluid outlet provided on one of said first fluid manifold and said second fluid manifold; and
a quick connect coupling in communication with said at least one fluid outlet.
11. The low profile cooling system of claim 10, wherein said heat exchanger is a liquid-to-air heat exchanger.
12. The low profile cooling system of claim 11, wherein said liquid-to-air heat exchanger further comprises a condenser coil having a plurality of cooling fins, said condenser coil being shaped to fit about a central cooling fan.
13. The low profile cooling system of claim 11, wherein said liquid-to-air heat exchanger is a flat pack radiator.
14. A cooling fluid backplane comprising:
at least one low profile extrusion of unitary construction having an exterior surface adapted for receiving heat from a heat sink and being formed with a unitary array, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship, at least one of said plurality of microtubes having a microtube inlet and a microtube outlet;
a first fluid manifold providing fluid communication between said fluid inlet and said microtube inlet of said at least one unitary low profile extrusion; and
a second fluid manifold providing fluid communication between said fluid outlet and said microtube outlet of said at least one unitary low profile extrusion;
at least one fluid inlet provided on one of said first fluid manifold and said second fluid manifold; and
at least one fluid outlet provides on one of said first fluid manifold and said second fluid manifold.
...das Problem, bzw. was spricht dagegen zu schreiben: "in Flachbauweise", oder für ein Patent wegen mir "in flacher Bauweise/Ausführung". Oder vielleicht sogar "Kompakt-Flachbauweise"? -- Gibt es denn etwas, was gegen eine mehr o. weniger wörtliche Übersetzung spricht?
The translation workplace 
peer agreement (net): -1
