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07:57 Jan 4, 2003 |
English to Japanese translations [PRO] Tech/Engineering / semiconductor, packaging | |||||||
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| Selected response from: studio_rain Japan Local time: 09:06 | ||||||
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Summary of answers provided | ||||
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4 | 下結合。 |
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3 +1 | 基板接合(結合) |
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1 | ダウンボンド、ダウンボンディング |
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下結合。 Explanation: the term means down binding/attachment/join/docking the things.i think that the meaning of this one here is attach or join the part from the down side/bottom side. -------------------------------------------------- Note added at 2003-01-04 08:16:54 (GMT) -------------------------------------------------- i hope it will help you.i also find the more appropriate explaination. Reference: http://[email protected] |
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ダウンボンド、ダウンボンディング Explanation: I guess it means a kind of wirebonding (ワイヤボンディング) methods, but I can find no corresponding entries in my「半導体製造装置用語辞典」第5版(日刊工業新聞社). Reference: http://www.mosis.org/Technical/Packaging/pkg-intro.html#down... |
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基板接合(結合) Explanation: 下記urlによるとdownbond は substrate connection と呼ばれることもあるとのこと。substrateはIC関係では(回路)基板を指すことが多いと思います。 Reference: http://www.mosis.org/Technical/Packaging/pkg-intro.html#down... |
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