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16:23 Feb 2, 2009 |
English to Spanish translations [PRO] Tech/Engineering - Computers (general) | |||||||
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| Selected response from: Miguel Armentia Spain Local time: 08:56 | ||||||
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Summary of answers provided | ||||
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3 +1 | tecnología dual / doble núcleo |
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4 | tecnologia de embalaje con dos troqueles |
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tecnología dual / doble núcleo Explanation: Recomiendo la primera, que es la más extendida y la más general a su vez. http://en.wikipedia.org/wiki/Multi-core "A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together." http://es.wikipedia.org/wiki/Multi_núcleo |
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tecnologia de embalaje con dos troqueles Explanation: Quotation -Los nuevos SO-DIMMs de 2GB de Infineon están basados en la nueva tecnología de empaque “Dual-Die” Dos troqueles idénticos se colocan uno sobre otro en un módulo FBGA (Fine Ball Grid Array). Esto lleva a un tamaño de módulo que es virtualmente idéntico a un módulo de troquel único. -Quotation Reference: http://www.mctlat.com/productos/tecnologias_ddr2.htm |
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