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Hot melt adhesives are solvent-free adhesives, that are characteristically solid at temperatures below 180 degrees F (°F), are low viscosity fluids above 180°F, and rapidly set upon cooling. The development of hot melt adhesive technology stemmed from the previous use of molten wax for bonding. When this method no longer satisfied performance needs, 100 percent thermoplastic systems were introduced. Today, hot melt adhesives are used in a variety of manufacturing processes, including bookbinding, product assembly, and box and carton heat sealing.