19:49 Aug 14, 2006 |
English language (monolingual) [PRO] Tech/Engineering - Electronics / Elect Eng / RF and Microwave design | |||||||
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| Selected response from: jccantrell United States Local time: 04:09 | ||||||
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SUMMARY OF ALL EXPLANATIONS PROVIDED | ||||
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3 +5 | My shot |
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Discussion entries: 1 | |
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tops package My shot Explanation: From the context, TOPS is probably some sort of packing format. Think TO (transistor outline), DIL (dual inline) or DIP (dual inline package). These are standard packaging cocepts for semiconductors or integrated circuits. I was unable to find TOPS anywhere that would fit into this context. Even the abstract of the paper did not define it, so it may be a misprint. My suggestion would be to just use it as is, but to give a note to the client. P.S. LO is local oscillator, especially in this context. |
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