GLOSSARY ENTRY (DERIVED FROM QUESTION BELOW) | ||||||
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01:33 Aug 31, 2001 |
English to German translations [PRO] Tech/Engineering - Electronics / Elect Eng | |||||||
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| Selected response from: Hans-Henning Judek Local time: 06:06 | ||||||
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Summary of answers provided | ||||
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na +1 | Stopplack des Sackverbindungslochs in Microvias |
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Stopplack des Sackverbindungslochs in Microvias Explanation: Übersetzung zwar möglich, vielfach aber auch im deutschen Sprachraum die englischen Begriffe verwendet (siehe Referenzen) blind via: a via having connection to the surface of the PCB, but not going through all layers. buried via: going through one or more layers but without connection to the surface of the PCB. Bei dem Stopplack bin ich mir nicht so sicher. Empfehle also genaueres Studium der Referenz (website von SEAG) mit deinen Illustrationen. Reference: http://www.seag.de/de/produkte/ms_sequentielleraufbau.htm |
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