non-sawed wafers
Spanish translation: obleas sin separación
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| 01:49 Nov 6, 2008 |
| English to Spanish translations [PRO] Energy / Power Generation | |||||||
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|  Selected response from: Jennifer Levey Chile Local time: 06:41 | ||||||
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| 4 +1 | obleas sin separación |
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| 4 | obleas sin cortar |
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| 4 | Placas no cortadas |
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Answers
11 mins confidence: 
peer agreement (net): +1
peer agreement (net): +1obleas sin separación Explanation: Lecturas pertinentes: Method of processing a single semiconductor using at least one ... - [ Traducir esta página ]These positions are preferably the same as those on the non-separated product, for example, the non-sawed wafer. The conflict constituted by these mutually ... www.freepatentsonline.com/6391679.html - Páginas similares de J Anker - 2002 - Artículos relacionados - Las 3 versiones Method of processing a single semiconductor using at least one ... - [ Traducir esta página ]same way as it is possible for a non-separated product (non-sawed wafer), while the handling or mechanical production manipulation of the products ... www.patentstorm.us/patents/6391679/description.html - Páginas similares Method of processing a single semiconductor using at least one ... - [ Traducir esta página ]A method of processing a substantially wafer-shaped product in semiconductor ... positions on the second carrier element as compared with the non-sawed ... www.patentstorm.us/patents/6391679/claims.html - Páginas similares [PDF] 15th Workshop on Crystalline Silicon Solar Cells and Modules ...Formato de archivo: PDF/Adobe Acrobat Separated Si sheet which has a structure like Fig.4, is cutting by laser to form a rectangular flat. Si wafer. Non-Sawed Silicon Sheet. Sharp Process ... www.nrel.gov/docs/fy06osti/38573.pdf - Páginas similares de BL Sopori - 2005 Method of processing a single semiconductor using at least one ... - Resultado de patentes de GooglePatente estadounidense 6391679 - U.S. Philips Corporation A method of processing a single substantially wafer- shaped semiconductor ... on the second carrier element as compared with the non-sawed semiconductor, ... www.google.cl/patents?id=nsoKAAAAEBAJ Method of processing a single semiconductor using at least one ... - Resultado de patentes de GooglePatente estadounidense 6391679 - U.S. Philips Corporation ... is to be tested first on a wafer and the electrical contacting devices of the ... on the second carrier element as compared with the non-sawed product, ... www.google.cl/patents?id=nsoKAAAAEBAJ Manufactura, Ingeniería y Tecnología - Resultado de la Búsqueda de libros de Googlede Serope Kalpakjian, Serope Kalpakjian Steven R ... - 2002 - 1152 páginas Después de terminar esta prueba a nivel oblea, cada dado se separa de ella. La técnica de separación que se usa más es la de sierra de diamante, ... books.google.cl/books?isbn=9702601371... -------------------------------------------------- Note added at 13 mins (2008-11-06 02:02:04 GMT) -------------------------------------------------- The cost reduction comes from the fact that if you don't separate the wafers ... you don't have to connect them together afterwards to make a PV panel. -------------------------------------------------- Note added at 21 mins (2008-11-06 02:10:30 GMT) -------------------------------------------------- Although 'non-sawed' and 'non-sawn' are both found on google (2 Ghits each!), 'non-sawn' is better English. non-sawn refs: LDK SOLAR CO., LTD. - LDK Annual and Transition Report (foreign ... - [ Traducir esta página ]Non-sawn wafer technologies consist primarily of ribbon wafers and sheet wafers. For sawn wafer technologies, polysilicon is converted into monocrystalline ... sec.edgar-online.com/2008/04/07/0001145549-08-000623/Section10.asp - 53k - En caché - Páginas similares [PDF] RENEWABLE ENERGY CORPORATION ASA ABG Sundal Collier UBS Investment ...Formato de archivo: PDF/Adobe Acrobat Non-sawn wafer technologies: ribbon and sheet ... Non-sawn wafer. technologies accounted for approximately 3% of wafer production in 2005, according to ... www.recgroup.com/default.asp?FILE=items/961/249/Final REC I... - Páginas similares |
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4 hrs confidence:
obleas sin cortar Explanation: Tu pregunta parece referirse a la fabricación de circuitos integrados. El término que propongo es utilizado en una tesis doctoral en física publicada por el Centro Nacional de Microelectrónica y la Universidad de Barcelona: Aparece en la página 183: "La caracterizaciónse hizo sobre los dispositivos en las obleas sin cortar, y es de esperar que esta corriente disminuya al cortar los dispositivos". (http://www.cnm.es/projects/atlas/thesis/Celeste_Fleta_Tesis.... Atentamente, Daniel |
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4 hrs confidence:
Placas no cortadas Explanation: Es preferible el término "placa" a "oblea" ( que es una traducción literal). |
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