GLOSSARY ENTRY (DERIVED FROM QUESTION BELOW) | ||||||
---|---|---|---|---|---|---|
|
16:40 Mar 13, 2014 |
German to English translations [PRO] Tech/Engineering - Manufacturing / semiconductors / soldering procedures | |||||||
---|---|---|---|---|---|---|---|
|
| ||||||
| Selected response from: Fabius Maximus Local time: 17:28 | ||||||
Grading comment
|
Summary of answers provided | ||||
---|---|---|---|---|
5 | Bonding knife |
| ||
3 | bonding meter |
|
Discussion entries: 2 | |
---|---|
bonding meter Explanation: Das Wort gibt es im Deutschen nicht. Ich nehme an, es handelt sich um eine Fehlübersetzung aus dem Englischen: Ein bonding meter ist ein Erdungsprüfgerät, Massenverbindungsprüfer etc. -------------------------------------------------- Note added at 12 Min. (2014-03-13 16:53:32 GMT) -------------------------------------------------- Guck mal z.B. hier: http://www.google.de/url?sa=t&rct=j&q=&esrc=s&source=web&cd=... |
| |
Login to enter a peer comment (or grade) |
Bonding knife Explanation: In the semiconductor industry the wires are attached to the silicon chips with ultrasonic bonding using a tool called "knife" to hold the wire on place during the operation Reference: http://www.google.com.br/patents/US6905058 |
| |
Grading comment
| ||
Login to enter a peer comment (or grade) |
Login or register (free and only takes a few minutes) to participate in this question.
You will also have access to many other tools and opportunities designed for those who have language-related jobs (or are passionate about them). Participation is free and the site has a strict confidentiality policy.