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stiftloses Verpressen

English translation: pin lam

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16:19 Nov 5, 2000
German to English translations [PRO]
Tech/Engineering - Electronics / Elect Eng
German term or phrase: stiftloses Verpressen
context: production of printed circuit boards
"Selbstverständlich muss neben der Wirtschaftlichkeit auch die Qualität bei hochkomplexen Leiterplatten stimmen. Einseitig oder doppelseitig, Multilayer mit bis zu 24 Lagen -- mittels stiftlosem Verpressen -- und Oberflächenveredelung mit Hot Air Levelling oder bereits bleifreie Alternativen. Bei jedem Schritt gelten die Europa-Norm DIN EN ISO 9002 und die UL-Freigaben für alle Produktgrupen."
Any help greatly appreciated!
Beth Kantus
United States
Local time: 18:41
English translation:pin lam
Explanation:
I've worked over 3 years in the PCB industry (Leiterplatte), as technical assistance to customers. SMD refers to the components that will be mounted on the board.

In this case Verpressen means "lamination", the process whereby the layers are stacked and pressed together to obtain the multilayer. usually the layers are centerd using registration pins (stifte). But for high layer count boards (such as 24 Layers), the conventional method is unreliable, in those cases, a new procedure is used: Pin lam, where there are 4 guides of rectangular section instead of cilindrical pins. Paradoxically, although no "pins" are used, the method is called pin lam /pin lamination, to distinguish it from the conventional "mass lamination"
Selected response from:

pedro_barcelona
Spain
Local time: 00:41
Grading comment
Thanks to both of you for your help. I went with "pin lam" on this one, though, as I'm pretty sure the context related to the actual manufacture of the board and not the subsequent placement of components. Nonetheless, the SMT references were very helpful. Thanks again!
4 KudoZ points were awarded for this answer

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Summary of answers provided
napin lampedro_barcelona
naSMT (surface mount technology)Ulrike Lieder


  

Answers


1 hr
SMT (surface mount technology)


Explanation:
It took me a while to make the connection (no pun intended), but it was the search on AOI that reminded me of SMT = surface mount technology in which pins are not inserted into holes on the PCB.

See the following excerpts:
Oberflächenmontage Subst. (surface-mount technology)
Ein Bestückungsverfahren für Leiterplatten, bei dem man die Bauelemente nicht mehr in vorgebohrte Löcher einlötet, sondern direkt auf der Oberfläche der Leiterplatte befestigt. Die Vorteile sind Kompaktheit, Vibrationsfestigkeit und die Möglichkeit dichterer Leiterbahnverbindungen. ® Vgl. DIP, Pin-Gitter, pinlose Chipanbringung.
pinlose Chipanbringung Subst. (leadless chip carrier)
Eine Methode der Chip-Montage auf Platinen. Eine pinlose Chipanbringung weist Kontaktflächen (keine Stifte) zur Verbindung mit der Platine auf. Der Chip verbleibt in einem Sockel, der die Verbindung über Kontaktflächen an der Unterseite gewährleistet. Für einen sicheren Kontakt sorgt die entsprechende Befestigung des Chips
PLCC Subst.
Abkürzung für Plastic Leadless Chip Carrier. Eine kostengünstige Variante der LCC-Technologie (LCC - stiftloser Chipträger) für die Chip-Montage auf Platinen. Obwohl sich beide Träger äußerlich gleichen, sind PLCCs physikalisch nicht kompatibel mit LCCs, die aus keramischem Material hergestellt werden. ® siehe auch pinlose Chipanbringung.
http://www.gerves.de/lexica/pclex/o.htm

See also the following sites:
www.smtnet.com/bookstore/publications/0-07-036648-9/
www.fujitsu-fme.com/news/press/show.php3?arid=102&prid=58
www.cs.arizona.edu/japan/atip/public/atip.reports.95/atip95...
www.4smt.com/techpprs/gluprint/glupri.html
HTH!


Ulrike Lieder
Local time: 15:41
Native speaker of: German
PRO pts in category: 12

Peer comments on this answer (and responses from the answerer)
Mats Wiman

Ken Cox
Login to enter a peer comment (or grade)

7 hrs
pin lam


Explanation:
I've worked over 3 years in the PCB industry (Leiterplatte), as technical assistance to customers. SMD refers to the components that will be mounted on the board.

In this case Verpressen means "lamination", the process whereby the layers are stacked and pressed together to obtain the multilayer. usually the layers are centerd using registration pins (stifte). But for high layer count boards (such as 24 Layers), the conventional method is unreliable, in those cases, a new procedure is used: Pin lam, where there are 4 guides of rectangular section instead of cilindrical pins. Paradoxically, although no "pins" are used, the method is called pin lam /pin lamination, to distinguish it from the conventional "mass lamination"

pedro_barcelona
Spain
Local time: 00:41
Works in field
Native speaker of: Native in SpanishSpanish
PRO pts in category: 4
Grading comment
Thanks to both of you for your help. I went with "pin lam" on this one, though, as I'm pretty sure the context related to the actual manufacture of the board and not the subsequent placement of components. Nonetheless, the SMT references were very helpful. Thanks again!

Peer comments on this answer (and responses from the answerer)
Ken Cox
Login to enter a peer comment (or grade)




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Changes made by editors
Mar 16, 2009 - Changes made by Steffen Walter:
Field (specific)(none) » Electronics / Elect Eng


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