English to Russian Tech/Engineering Manufacturing Изготовление п/п пластин

Many different types of wafers can potentially be run through
the same tool for different deposition layers. Each of these
will have different up-stream processing characteristics based
on the underlying layers, such as: photoresist ash and strip,
oxide or low-K etch, dielectric or low-K deposition, oxide and
metal plug (W) polish, wet clean, DI water rinse and dry.