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business advisory and consultancy services in the field of the assembly, manufacture and production of electrical and electronic apparatus and components providing an on-line database on the Internet in the field of back-end assembly of semiconductors, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment and tools, dicing equipment and blades, factory automation products and services, laminate technology services, manual wire bonding equipment, tools and materials, package singulation equipment and blades, solder ball placement equipment, wafer bumping equipment, tools and materials, wafer bumping services, after preparation equipment, and customer support services relating thereto, including supply, logistics and support, factory productivity, training and equipment refurbishment.